About site: Physics/Instruments and Supplies - Tectra Plasma Sources

About site: http://www.plasma-source.de/

Title: Physics/Instruments and Supplies - Tectra Plasma Sources Provides the Tectra Plasma Source, a multi-purpose source producing either atoms or ions and finds uses in a range of HV and UHV applications.

Teledyne_Hastings_Instruments Manufacturer of vacuum and flow instruments for the measurement and control of vacuum and gas flows.

UHV_Design Manufacturer or vacuum components for molecular beam epitaxy (MBE), UHV sputtering, vacuum thin films and other UHV vacuum deposition components.

Vacutec Produces hemispherical energy analysers, electron, X ray, ion sources, and sample transfer. Includes list and description of products.

Vacuum_Controllers,_From_Hastings_Instruments Hastings Instruments manufactures a complete line of Vacuum Instruments including Vacuum Controllers, for the precise measurement and control of vacuum and gas flows.

Vatell_Corporation Produces a line of HFM heat flux microsensors and circular foil heat flux gages.

VME_for_Physics_and_Industrie Provides process control, supervisory data acquisition systems and VME scalers and counters.

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Vorg_Electronics Manufacturer of electronic transformers for halogen lamps, photomultiplier tube bases, cables, electronic transformers, PMT bases, PMT Arrays, transformers, and custom built electronics

Voss_Scientific Provides data acquisition and analysis, PC-based satellite telemetry, high-power microwave (HPM) sources, and computational electromagnetic products.

Walker_LDJ_Scientific,_Inc_ Manufacturer of magnetic measurement and analysis equipment. In addition, the company manufactures power supplies, laboratory electromagnets, and helmholtz coils.

WITec_GmbH Manufacturer of equipment for scientific and industrial applications focused on new solutions for Optical and Scanning Probe Microscopy.

X-ray_3-dimensional_Non-destructive_Microscopy Developer and producer of microtomography (Micro-CT) system for non-destructive 3-dimensional microscopy inside opaque objects.

X-TRONIX_Scientific_and_Industrial_Technologies Provides equipment for vacuum techniques, including consumables, thin films and surface science, gas flow control, helium cryogenics, and particle physics.

Air_Pollution,_Lichens_and_Mosses Brief article.

Arizona_State_University_Lichen_Herbarium Information about the collection, the Sonoran Desert Lichen Flora Project, research, and online course material.

British_Lichen_Society Advance interest in all branches of lichenology. Includes comprehensive information on British lichens.

Churchyard_Lichens General information.

Dutch_Lichens Photos and information about lichen biology. In Dutch and English.

Endangered_Lichens List of species protected by law in different countries.

European_Species_of_the_Lecanoraceae_Family Information on monograph.

Information_about_Lichens Description, structure, and environmental importance.

Introduction_to_Lichens Information about lichens including fossil record, life history, ecology, morphology and systematics.

Invasion_of_Pollution-tolerant_Lichens Research on the distribution of four pollution-tolerant non-native lichens in the Pacific Northwest.

Lichen_Biology Introduction to lichens, which are stable, self-supporting associations between fungi (most commonly Ascomycota) and photobionts (algae or cyanobacteria). Intended for university students.

Lichen_Research_Program,_University_of_Maine_at_Fort_Kent Information about Steve Selva's research program in lichenology. Includes a photo gallery of stubble lichens under the microscope.

LichenLand General information for young students including synoptic key and photos.

Lichenology_in_the_Netherlands Red list including lichenicolous fungi, and additional information about projects and publications.

Lichens_-_Silent_Witnesses_of_Air_Quality Information on monitoring air quality, bibliography, and photos.

Lichens_of_North_America Information about lichen biology, lichens and wildlife, lichens and people, and the book of the same title, which was published in 2001.

Lichens_de Photos of lichens taken during British Lichen Society field trips in Britain. Contains general information and related links.

New_Zealand_Forest_Lichens Photographs, general information, identification and related links.

North_American_Lichen_Checklist List of cumulative updates to the most recently published North American checklist by Esslinger and Egan (1995).

Queensland_Lichens General information on subtropical lichens from Queensland, Australia. Includes keys to genera and species, and glossary.

Rhode_Island\'s_Foliose_and_Fruticose_Lichens Habitat notes, distribution maps, and color photographs of over 90 species of macrolichens by Don Flenniken.

Roccella Lichen genus found in Venezuela.

Taxonomy_of_Philippine_Lichens Brief information and links by researcher Isidro T. Savillo.

Codex_Alimentarius_Commission Part of FAO and WHO food and veterinary standards activities. With information about procedure, forthcoming activities, members and participating organizations. All Codex Alimentarius standards docum

Consultative_Committee_for_Space_Data_Systems_(CCSDS) An organization of Space Agencies and produces recommendations and standards mainly for ground systems and their interface to space systems. The organization's work is detailed, and includes extensive

Council_for_Optical_Radiation_Measurements_(CORM) Develops requirements for standards, calibration services and collaboration programs.

EuroMed_Transport_Project EuroMed Transport’s official website, project funded by the EU, aiming to policy convergence and harmonisation of legislations governing the transport sector in the MEDA region.

European_Committee_for_Banking_Standards_(ECBS) Develops technical standards for the European banking infrastructure. With information on committee members, publications (available for download), the IBAN and current projects, and links to other or

European_Committee_for_Electrotechnical_Standardization_(CENELEC) Includes background information and a knowledge base.

The_European_Committee_for_Standardization_(CEN) Promotes voluntary technical harmonization in Europe in conjunction with worldwide bodies and its European partners.

European_Coorperation_on_Space_Standardization_(ECSS) European standards organization for space activities. Documents can be downloaded after free registration. With a discussion forum.

European_Telecommunications_Standards_Institute_(ETSI) Seeks to produce the telecommunications standards that will be used throughout Europe and beyond.

IEEE_Industry_Standard_and_Technology_Organization_(ISTO) A global, not-for-profit corporation designed to accelerate and extend traditional standards development and adoption activities for technology industry consortia.

Institute_of_Electrical_and_Electronic_Engineers_(IEEE) With information on standardization activities and procedures and the advantages of participating in standardization work.

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Plasma Source as atom source, ion source and atom/ion hybrid source (microwave plasma source)

plasmasource, plasma ion source, ion source, ECR source, atom source, atom beam source, microwave plasma source, plasma,source, microwave ion source, broad beam ion source, RF plasma source, RF source, kaufman ion source, kaufmann ion source, kaufman source, kaufmann source, microwave, ECR, RF

Plasma Source: introducing the secondgeneration of Atom Sources, Ion Sources and Atom/Ion Hybrid Sources. Plasma Source, Gen2

tectra Gen2 Plasma Source Since 1997 tectra has produced morethan 50 Plasma Sources as Atom Source, Ion Source and Atom/Ion Hybrid Source.Based on this experience we now present the second generation sources,the Gen2.New Features of Gen2 Plasma Source:high performance direct microwave coupling(without need of tuning)improved microwave guide with minimisedattenuationhigher plasma density resulting in higherion currentbakeable magnets, still on air side, withclosed cooling loopmore compact, space saving air side setupAl2O3 plasma cupnow standard with higher yield of secondary electrons and better resistanceagainst aggressive gasesadditional display of extraction currentto optimise the beam shapeimproved stability of microwave generationnew grid supply for more versatile, widerange ion energies of 20eV - 2keV with same grid set LED to show if plasma is on or off

pdfversion of data sheet (206kB) Plasma SourceAtom Source, Ion Sourceand Atom/Ion Hybrid SourceThe tectra Plasma Source* is a multi-purposesource which can easily be user configured to produce either atoms or ionsand finds uses in a wide range of HV and UHV applications. By easy exchangeof the beam optics the source can be configured to operate in several distinctmodes. The main modes are Atom Source, Ion Source and Atom/Ion Hybrid Source.Besides delivering different species (atoms, ions, radicals) the PlasmaSource covers the complete energy range from neutral thermal atoms to above1.500eV. The shape of the beam and current densities can be altered byusing different beam optics.A plasma is created in a coaxial waveguideby evanescent wave coupling of microwave energy at 2.45GHz. The plasmais further enhanced by the ECR action of a quadrupole magnetic field producingan extensive surface in the plasma on which electron cyclotron resonanceat the given microwave frequency takes place. Plasma Source + Power Supplies

tectra Plasma Source + Power Supplies(new pictures coming soon)Key Features: Filamentless Suitable for use with most gases includingreactive gases such as oxygen, chlorine, hydrogen, nitrogen etc.No microwave tuning Factory set. Simply turn the plasma onand off.User configurable The extraction optics are designed tobe quickly and easily exchanged allowing users to customise their sourceto suit a particular combination of sample size, working pressure and currentdensity. Easily exchanged apertures enable beam diameter, gas load andatom flux to be optimised.simple bakeout preparationnew bakeable ECR magnets allow simplebekeout preparation by just undoing 4 screws. The magnets are still onthe air side on a closed cooling loop. Hence no sintered material is in-vacuum.Al2O3 plasma regionAlumina plasma cup as standard with higheryield of secondary electrons and better resistance against aggressive gasessuch as Oxygencompactthe air side envilope sizes are broughtto a minimum of just 258mm from flange (knife edge side) to case end (seeschematic)Integration of the robust microwave generatorand the ion source, mean that no tuning of the source is required and thereis no waveguide to construct or install.Due to the evanescent wave coupling, noelectrodes are present in the plasma i.e. no filaments or other metal. The plasma is entirely surrounded by alumina or other dielectric materialse.g. BN. Therefore the source is also suitable for use with reactive gasessuch as oxygen and hydrogen. A selection of apertures and conductancesallows the optimum balance between gas flow, working pressure and beamcurrent to be achieved.The source is designed as a true UHV sourcemaking it suitable for use in UHV applications such as MBE as well as sputteringand other HV processes. Stainless steel, OFHC copper, BN, alumina and Kaptonare the only materials exposed to the vacuum. All joints are welded. Themagnets and all microwave parts are easily removed for bakeout at temperaturesin excess of 200°C. Modes of operation:Four distinct modes of operation are possiblewith this source depending principally on the beam optics which are fitted.The beam optics are constructed as one piece and may easily be exchangedby the user to allow the source to be used in another mode. The parts necessaryto convert the source from one mode to another are all retrofittable bythe user and can be added at any time in the future as research needs change.(1) Atom sourceThe specially designed aperture plateinhibits ions from escaping from the plasma, yet allows reactive neutralsto escape and form the dominant beam fraction. The emitted particles arelargely thermalised through multiple collisions on passing through theaperture. These neutrals have proven to be very effective in lowdamage surface treatments such as nitridation and oxidation(1,2). The furtheraddition of an ion-trap option can completely remove the residual ion contentfrom the beam where this may be of concern. (2) Downstream plasma sourceWith this aperture plate a larger proportionof the charged particles in the plasma are allowed to escape. There isno active extraction or acceleration of the charged particles but a considerablyhigher ion current reaches the sample in this mode as compared with theatom source above. Samples mounted a few centimetres from the source aresaid to be �downstream� of the ion source and away from the mostenergetic species. Ion energies are defined by the intrinsic plasma potentialand are around 25eV.(3) Hybrid sourceThe beam optics in this mode combine theatom source aperture plate with electrodes providing active extractionof ions from the plasma. With no voltage applied to the electrodes thesource functions like the atom source at (1) above. With voltageapplied to the electrodes, ions with controllable energy can be added tothe atom beam. Total beam current is in the ~50µA range. Usingthis mode the advantages of both a low kinetic energy, chemically reactive,atom beam and a much higher kinetic energy, highly anisotropic ion beammay be explored.(4) Broad Beam Ion SourceDual or triple high conductance grid electrodesare used to produce the broad beam ion source mode. For sputteringapplications, current densities at ~120mm of 2mA/cm² (focused optics)with ion energies of 1.3keV can be obtained while for deposition assistance(Ion Assisted Deposition or Dual Ion Beam Sputtering) the beam energy canbe reduced to less than 100eV with current densities still in the 0.05mA/cm²range.Atom Source Mode Applications: Nitriding e.g. GaN, AlN, GaAsN, SiN etc. Hydrogen cleaning, hydrogen assisted MBE. Oxidation e.g. ZnO, Superconductors, Opticalcoatings, Dielectrics. Doping e.g. ZnSe Ion Beam Mode Applications: Ion beam assisted deposition (IBAD) forboth UHV and HV processes Sputter deposition and dual ion beam sputtering Sputter cleaning / surface preparationin surface science, MBE and HV sputter processes. In-situ etching e.g. Chlorine Plasma Source schematic

Specificationsa) GeneralVacuum compatibility: Fully UHV compatibleBakeable:>200°CMicrowave power:250W max at 2.45GHzMagnet type:Permanent rare-earth. Removeablefor bakeout without breaking vacuumMounting:NW63CF (4.5"OD)In vacuum length:300mm (custom lengths possible): In vacuum diameter max = 57mmBeam diameter:~25mm at source (narrower beams alsoeasily produced)Plasma cup:AluminaAperture:Alumina or Boron Nitride Gas flow rate:0.01-100sccm depending on apertureselectedWorking pressure:~10-7 Torr to 5x10-3 Torr depending on aperture, pump and application - please contact tectrato discuss your application. Differential pumping option availableWorking Distance:50mm-300mm. 150mm typicalCooling:Fully water-cooled (including magnetron)Power supplies:MicrowaveGrid supply** Ion and Hybrid Sourceonly19� rack mount. 3U height. 230VAC,50Hz or 115VAC, 60Hz19� rack mount. 3U height. 230VAC, 50Hz or 115VAC, 60Hz b) Atom sourceAtom flux>2x1016 atoms/cm2/sat 10cm Beam divergence:~ 15° half-angle typicalGasesNitrogen, Oxygen, Hydrogen (any mostother non-condensible gases)Working pressure:1x10-8 mabr to 1x10-1mbar typical (using 500l/s pump) and depending on selected grids,pump, optional differential pumping and gases. Working distance:<50mm to>300mm (150mm typical)Options:(1) Residual Ion Trap(2) Differential pumping(3) Ion source retrofit kit(4) Plasma igniter c) Ion sourceIon current:0 - 20mA (max.). Total beam currentmeasured at 15cmIon current density:>2mA/cm2 at 1.3keV and>0.05mA/cm2at <100eV at 120mm distance.Ion energy:25eV - 2000eVBeam diameter:~25mm at source (narrower beams downto 1mm also easily produced)Extraction grids:Molybdenum (Graphite optionally)Focused and collimated beam grid setsavailableGas flow rate:5-10sccm typical (lower and higherflow ratespossible)Working pressure:1x10-8 mabr to 1x10-1mbar typical (using 500l/s pump) and depending on selected grids,pump, optional differential pumping and gases. Working distance:<50mm to>300mm (150mm typical)Options:(1) Immersed filament beam neutralisation(2) Plane, focused and divergent gridsets made from molybdenum or pyrolytic graphite(3) Differential pumping(4) Shutter(5) Faraday Cup integrated in shutter Options Plasma Source with differential pumping for low pressure operation

Plasma Source with differential pumpingfor low pressure operation and with shutter Plasma Source with differential pumping for high pressure operation

Plasma Source with differential pumpingfor high pressure operation

special Atom aperture for reduced flux/smallsamples

Atom aperture with quartz collimator tubespecial Atom aperture for reduced flux/smallsamples

Elongated version with second gas inletReferences:The role of neutral oxygen radicals in theoxidation of Ag films. A. A. Schmidt, J. Offermann and R. Anton. Thin Solid Films 281-282 (1996) 105-107. Design and performance of a versatile cost-effectivemicrowave ECR plasma source for surface and thin film processing. R.Anton,T. Wiegner, W. Naumann, M. Liebmann, C. Klein, C. Bradley. Rev.Sci.Instr.Feb 2000 tectra GmbH reservesthe right to alter specifications without notice.Application Note*developed in collaborationwith Prof. Dr. Anton, University of Hamburg, Inst. fuer Angewandte Physik contact:tectra GmbH Reuterweg 65 D-60323 Frankfurt/M. Tel: Germany (+49) (0) 69 - 72 00 40 Fax: Germany (+49) (0) 69 - 72 04 00 email: info@tectra.de ContactHomeProductslast modified 15.11.03

Provides	the	Tectra	Plasma
Source,	a	multi-purpose	source
producing	either	atoms	or	ions
and	finds	uses	in	a
range	of	HV	and	UHV
applications.

http://www.plasma-source.de/

Tectra Plasma Sources 2008 November

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Provides the Tectra Plasma Source, a multi-purpose source producing either atoms or ions and finds uses in a range of HV and UHV applications.

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